SiC系列功能模块
E3/SiC系列
- 电路图：详见左侧
- 应用：
- 特性：端子超声波焊接，铜线键合工艺，高强度陶瓷基板。
- 在线咨询
| Product | Product Status | Vces(V) | Vges(V) | Ic(A) | Configuration | Vce(sat) (V) | Vf((V) | Eon (mj) | Eoff(mj) |
| DMH300B12NE3P1 | Developing | 1200 | +25/-10 | 300 | Half Bridge | 1.30 | 1.60 | T.B.D | T.B.D |
| DMH400B12NE3P1 | Developing | 1200 | +25/-10 | 400 | Half Bridge | 1.30 | 1.60 | T.B.D | T.B.D |
| DMH600B12NE3P1 | Developing | 1200 | +25/-10 | 600 | Half Bridge | 1.30 | 1.60 | T.B.D | T.B.D |
| DMH300B12NE3P1 | Developing | 1200 | +20/-4 | 300 | Half Bridge | 1.80 | 2.00 | T.B.D | T.B.D |
| DMH400B12NE3P1 | Developing | 1200 | +20/-4 | 400 | Half Bridge | 1.80 | 2.00 | T.B.D | T.B.D |
| DMH600B12NE3P1 | Developing | 1200 | +20/-4 | 600 | Half Bridge | 1.80 | 2.00 | T.B.D | T.B.D |
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