SiC Power Module
E3
- Circuit diagram: see the left side for details
- Scope of application/li>
- Characteristic：Ultrasonic welding of terminal, copper bonding process, high strength ceramic substrate.
- INQUIRY
| Product | Product Status | Vces(V) | Vges(V) | Ic(A) | Configuration | Vce(sat) (V) | Vf((V) | Eon (mj) | Eoff(mj) |
| DMH300B12HE3P1 | Available | 1200 | +20 | 300 | Half Bridge | 2.00 | 1.70 | 9.1 | 17.3 |
| DMH450B12HE3P1 | Available | 1200 | +20 | 450 | Half Bridge | 2.00 | 1.90 | 11.5 | 39.5 |
| DMH600B12HE3P1 | Available | 1200 | +20 | 600 | Half Bridge | 2.00 | 2.00 | 20.6 | 52.4 |
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Email：info@dynpower.cn
Add： No. 77, Louyang Road, Suzhou Industrial Park
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